Thermal Shock Cycle Test Chamber

Thermal Shock Cycle Test Chamber

Test purpose:

• Assess c
• Assesscomponent endurance to thermal expansion mismatch, cyclic fatigue damage and assorted
• Assess component endurance to thermal expansion mismatch, cyclic fatigue damage and assorted mechanical stresses generated through recurring temperature swings. It focuses on measuring the tolerance level of multi-material assemblies to interfacial stress formed by different thermal expansion rates under repeated thermal cycling loads.
• Characterize the environmental endurance of parts subjected to combined high-temperature and high-humidity aging, followed by exposure to freezing sub-zero temperatures. This procedure reproduces harsh alternating climatic conditions to validate whether components maintain stable performance amid drastic hot-humid to cold temperature shifts.
• Measure the resistance of component constructions to chronic moisture intrusion over long service durations. It evaluates progressive deterioration caused by persistent vapor infiltration, such as corroded conductive parts, reduced insulation properties and separation of bonded internal structures.
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Main technical parameters:
temperature range:﹣50℃~150℃
temperature deviation:≤±20℃

humidity range:20%~98%R.H
humidity deviation:±2%(>75%RH); ±5%(≤75%RH)
Humidity fluctuation:≤1.5%R.H
Humidity uniformity:≤3%R.H
Humidity stabilization time:Within 15 minutes after the temperature stabilizes

Humidity fluctuation:≤±1.0℃
Temperature Uniformity:≤2℃
Heating/cooling rate:0.5~5℃/min

(Customized according to customer needs)

IEC61215-2 MQT11
IEC61215-2 MQT12
IEC61215-2 MQT13
IEC61215-2 MQT21
IEC61730-2 MST51
IEC61730-2 MST52
IEC61730-2 MST53
IEC61730-2 MST55
IEC61730-2 MST56